The Optimization of Process Parameters by Fixed Abrasive Pad for Lapping Magnesium Aluminate Spinel

Abstract:

The process parameters affect the lapping efficiency and the surface quality of work pieces. The fixed abrasive pad of w3-5 diamond abrasive was used for lapping magnesium aluminate spinel wafers in orthogonal experiment. The affection of lapping pressure, plate speed and slurry type on material removal rate (MRR) and surface roughness Ra were investigated. Finally, the process parameters were optimized. The results showed that lapping efficiencies were higher and the surface quality was better on the conditions of Zhongjing slurry, lapping pressure 10.37Kpa and plate speed 100rpm.

• Periodical: Key Engineering Materials (Volume 693)
• Pages: 973-981
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.693.973
• Online since: May 2016
• Authors: Zhan Kui Wang*, Yan Ling Zheng, Jian Guo Yao, Jian Xiu Su
• Keywords: Fixed Abrasive Pad, Lapping, Magnesium Aluminate Spinel, Optimization

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