Hardness and Texture Evolution of Sputtered TiN Thin Films with Different Thicknesses on Ti6Al4V Substrate

Na Xiao; Bo Yang; Fei Fei Du; Yan Wu; Xiang Zhao; Gao Wu Qin

doi:10.4028/www.scientific.net/KEM.709.91

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 709Hardness and Texture Evolution of Sputtered TiN...

Hardness and Texture Evolution of Sputtered TiN Thin Films with Different Thicknesses on Ti6Al4V Substrate

Abstract:

In this present work, TiN films with various thicknesses (from 0.3 μm to 2 μm) were deposited by DC reactive magnetron sputtering on Ti6Al4V substrates. The evolution of texture and microstructure were studied by X-ray diffraction and Scanning Electron Microscopy, respectively. The XRD characterization indicates that the preferred texture of TiN films is changed from (111) to (100) with increasing the film thickness. The microstructure characterization shows that their microstructure transform from continuous into columnar with increasing the TiN film thickness. It is considered these results are arised from the change of overall energy including surface energy and strain energy with the film thickness. The hardness of TiN film increases with increasing the film thickness.

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Key Engineering Materials (Volume 709)

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91-94

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https://doi.org/10.4028/www.scientific.net/KEM.709.91

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September 2016

Authors:

Na Xiao*, Bo Yang, Fei Fei Du, Yan Wu, Xiang Zhao, Gao Wu Qin

Keywords:

Preferred Orientation, Strain Energy, Surface Energy, TiN Films

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