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Effect of in Addition to Zn-5Al Solder on Microstructure and Properties of Solder Joints
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Effect of in Addition to Zn-5Al Solder on Microstructure and Properties of Solder Joints

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Abstract:

The effect of In addition to Zn-5Al on the interfacial reaction behaviors and mechanical properties of solder joints were investigated. It was found that addition of In decreasing the melting point of Zn-5Al solder. The segregation of In on grain boundary was observed. CuZn5 and Cu5Zn8 intermetallic phases were observed at joint interface. Segregation of In on grain boundary caused a significant decrease of strength of the Zn-5Al-In solder compared to Zn-5Al. Addition of 1% In to Zn-5Al solder resulted in a reduction of shear strength of 14 MPa. The interfacial microstructure, shear strength and fracture surfaces of Zn-5Al/Cu and Zn-5Al-1In/Cu solder joints were studied.

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Proceedings of International Conference on Material Science and Engineering 2016 View Preview

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Periodical:

Key Engineering Materials (Volume 723)

Pages:

357-362

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.723.357

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Online since:

December 2016

Authors:

Igor Kostolný*, Roman Koleňák

Keywords:

Flux Free Soldering, Fracture Surface, Joints, Solder

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© 2017 Trans Tech Publications Ltd. All Rights Reserved

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