Microstructure and Thermal Physical Properties of a β­SiCp/Al Composite for Electronic Packaging Produced by Powder Metallurgy

Abstract:

The fabrication and thermal physical properties contain thermal conductivity (TC) and coefficient of thermal expansion (CTE) using 40%、50%、60% vol% β-SiC particle reinforced Al composite for electronic packaging respectively have been analyzed. The composites were produced by ball milling and pressing method. The composite which fabricated by tri-sized β-SiC particle with a weight ratio of 17:7:1,vol% of 50% and 60%.The dense and morphology were investigated. The relationship between volume fraction of β-SiC particle and thermal physical properties was discussed. Changed the volume fraction of β-SiC particle will led to a decreasing or increasing of TC and CTE. It found that values of TC and CTE were achieved their maximum balance when using tri-sized β-SiC particle of 160μm ,125μm as well as 38μm with a weight ratio of 17:7:1 and 50%vol of β-SiC particle reinforcing.

• Periodical: Key Engineering Materials (Volume 727)
• Pages: 565-570
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.727.565
• Online since: January 2017
• Authors: Yan Yan Shi*, Xiao Gang Wang, Jun Tao Liu
• Keywords: Electronic Packaging, Particulate Reinforced Metal Matrix Composite, Powder metallurgy, Thermal Conductivity, Thermal Expansion, β-SiC

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