Low Cycle Fatigue Test of Lead Free Solders Using Small Sized Specimen

Yutaka Konishi; Takamoto Itoh; Masao Sakane; Fumio Ogawa; Hideyuki Kanayama

doi:10.4028/www.scientific.net/KEM.734.194

Paper Titles

Study on High Temperature Creep Test of P92 Material Based on the Minimally Invasive Technique
p.159

Small Ring Testing of High Temperature Materials
p.168

Research on Fatigue Properties of Micron Scale Copper Bonding Wires
p.176

Development of Fatigue Testing Machine for Small Sized Specimen in Liquid Environment
p.185

Low Cycle Fatigue Test of Lead Free Solders Using Small Sized Specimen
p.194

An Alternative Method for Strain-Controlled Fatigue Test at Elevated Temperature
p.202

A Novel Method to Extract the Plastic Properties of Metal Materials from a Continuous Spherical Indentation Test
p.206

Determination of Creep Properties from Small Punch Test with Reverse Algorithm
p.212

Development of Testing Machines and Equipment for Small Punch Testing, Proposals for Improvement of CWA 15627
p.237

HomeKey Engineering MaterialsKey Engineering Materials Vol. 734Low Cycle Fatigue Test of Lead Free Solders Using...

Low Cycle Fatigue Test of Lead Free Solders Using Small Sized Specimen

Abstract:

This paper investigates the fatigue results in low cycle fatigue region obtained from a miniaturized specimen having a 6mm gage length, 3mm diameter and 55mm total length. Fatigue tests were performed for two type lead-free solders using horizontal-type electrical servo hydraulic push-pull fatigue testing machine. Materials employed were Sn-3.0Ag-0.5Cu and Sn-5Sb. The results from Sn-3.0Ag-0.5Cu were compared with those obtained using a bulk specimen in a previous study. Relationship between strain range and number of cycles to failure of the small-sized specimen agreed with those of the bulk specimens. The testing techniques are applicable to Sn-5Sb following the Manson-Coffin law. These results confirm that the testing technique proposed here, using small-sized specimen, is suitable to get fruitful fatigue data for lead-free solder compounds.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Key Engineering Materials (Volume 734)

Pages:

194-201

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.734.194

Citation:

Cite this paper

Online since:

April 2017

Authors:

Yutaka Konishi*, Takamoto Itoh, Masao Sakane, Fumio Ogawa, Hideyuki Kanayama

Keywords:

Lead-Free Solder, Low Cycle Fatigue, Small-Sized Specimen, Testing Method

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] K. Suganuma, Introduction to Lead-free Soldering, Osaka University Press (in Japanese), (2013).

Google Scholar

[2] J. Glazer, Microstructure and Mechanical Properties of Pb-free Solder Alloys for Low Cost Electronic Assembly: A Review, J. Electron. Mater. 23 (1994) 693-700.

DOI: 10.1007/bf02651361

Google Scholar

[3] M. Abtew, G. Selvaduray, Lead-free Solders in Microelectronics, Mater. Sci. Eng. R. 27 (2000) 95-141.

DOI: 10.1016/s0927-796x(00)00010-3

Google Scholar

[4] Y. Tsukada, H. Nishimura, M. Sakane and M. Ohnami, Fatigue Life Analysis of Solder Joints in Flip Chip Bonding, J. Electron. Packaging. 122 (2000) 207-213.

DOI: 10.1115/1.1286002

Google Scholar

[5] M. Sakane, Thermo-Mechanical Fatigue in Electronic Devices, J. Soc. Mater. Sci. Jpn. 56 (2007) 302-308.

Google Scholar

[6] S. Yoshioka, S. Tani, M. Kumasawa and A. Inoue, Low Cycle Fatigue Properties of Solder Material (36Pb62Sn2Ag) at Low Temperatures, J. Soc. Mater. Sci. Jpn. 39 (1990) 908-913.

DOI: 10.2472/jsms.39.908

Google Scholar

[7] C. Kanchanomai, Y. Miyashita and Y. Mutoh, Low-cycle Fatigue Behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi Lead-free Solders, J. Electron. Mater. 31 (2002) 456-465.

DOI: 10.1007/s11664-002-0100-0

Google Scholar

[8] M. Nozaki, M. Sakane, Y. Tsukada and H. Nishimura, Creep-Fatigue Life Evaluation for Sn-3. 5Ag Solder, J. Eng. Mater. Tech. 128 (2006) 142-150.

DOI: 10.1115/1.2172273

Google Scholar

[9] A. Katoh, N. Hiyoshi, M. Sakane, Y. Tsukada and H. Nishimura, Low Cycle Fatigue of Sn-37Pb and Sn-3. 5Ag Solders at Low Temperature, J. Soc. Mater. Sci. Jpn. 58 (2009) 155-161.

DOI: 10.2472/jsms.58.155

Google Scholar

[10] Y. Takamatsu, H. Esaka, and K. Shinozuka, Solidification Process and Volume Fraction in Sn-Ag-Cu Alloy, J. Jpn. Inst. Electron. Packaging 13 (2010) 521-530.

DOI: 10.5104/jiep.13.521

Google Scholar

[11] T. Itoh, N. Hiyoshi, M. Nozaki, A. Ueno, T. Yamamoto, S. Zhang, Factual Database on Tensile, Creep, Low Cycle Fatigue and Creep-Fatigue of Lead and Lead-free Solders Vol. 3 Low Cycle Fatigue Test, The Society of Material Science, Japan, (2013).

DOI: 10.1299/jsmemm.2018.os0907

Google Scholar