Study on High Temperature Creep Test of P92 Material Based on the Minimally Invasive Technique

Chao Zhou; Jun Liang; Bin Wang

doi:10.4028/www.scientific.net/KEM.734.159

Paper Titles

Influence of the Upper Die and of the Indenter Material on the Time to Rupture of Small Punch Creep Tests
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Effect of Build Orientation and Post Processing of a Direct Laser Deposited Nickel Superalloy as Determined by the Small Punch Creep Test
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Estimation of Anisotropy of Creep Properties in Al and Mg Alloys by Means of Small Punch Test
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The Application of the Small Punch Tensile Test to Evaluate the Ductile to Brittle Transition of a Thermally Sprayed CoNiCrAlY Coating
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Study on High Temperature Creep Test of P92 Material Based on the Minimally Invasive Technique
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Small Ring Testing of High Temperature Materials
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Research on Fatigue Properties of Micron Scale Copper Bonding Wires
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Development of Fatigue Testing Machine for Small Sized Specimen in Liquid Environment
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Low Cycle Fatigue Test of Lead Free Solders Using Small Sized Specimen
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 734Study on High Temperature Creep Test of P92...

Study on High Temperature Creep Test of P92 Material Based on the Minimally Invasive Technique

Abstract:

The tensile and creep properties of P92 steel have been studied using a precision tensile and creep test machines for miniature and conventional specimens under various stress level at 625°C. The results showed that the data stability of miniature plate specimens is high whether at room or high temperature tensile tests. Compared with the conventional plate specimens, tensile strength, yield strength and total elongation is slightly lower, the uniform elongation is higher for miniature plate specimens at room temperature. By contrast, the tensile strength and uniform elongation is slightly higher, and the yield strength and total elongation is lower at high temperature. Besides, there had similar creep curves between miniature and conventional specimens, and the creep rupture time and minimum creep rate are closer under the same stress. By comparing the power law creep index and damage tolerance factor at the second creep stage, it can be derived that the creep mechanism is identical for the micro and conventional specimens, which is controlled by the dislocation movement.

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Periodical:

Key Engineering Materials (Volume 734)

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159-167

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.734.159

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Online since:

April 2017

Authors:

Chao Zhou*, Jun Liang, Bin Wang

Keywords:

Creep Properties, Minimally Invasive Technology, P92

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