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Effect of in Addition on Microstructure and Properties of Zn-5Al Solder

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Abstract:

The effect of In addition on melting behaviors, microstructure and properties of Zn-5Al solder were investigated. It was found that addition of In decreasing the melting point of Zn-5Al solder. XRD analysis confirmed the presence of Indium in form of α-Zn+β-In solid solution. The segregation of In on grain boundary was observed. Segregation of In on grain boundary caused a significant decrease of strength of the Zn-5Al-In solder compared to Zn-5Al.

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Periodical:

Key Engineering Materials (Volume 737)

Pages:

107-113

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.737.107

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Online since:

June 2017

Authors:

Roman Koleňák, Igor Kostolný*

Keywords:

Hardness, Microstructure, Solder, Strength

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© 2017 Trans Tech Publications Ltd. All Rights Reserved

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