Interaction between Polyaramidic Electrospun Nanofibers and Epoxy Resin for Composite Materials Reinforcement

Stefano Merighi; Emanuele Maccaferri; Juri Belcari; Andrea Zucchelli; Tiziana Benelli; Loris Giorgini; Laura Mazzocchetti

doi:10.4028/www.scientific.net/KEM.748.39

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 748Interaction between Polyaramidic Electrospun...

Interaction between Polyaramidic Electrospun Nanofibers and Epoxy Resin for Composite Materials Reinforcement

Abstract:

Interaction between poly (m-phenylene isophtalamide) (PMIA) electrospun nanofibers and commercial epoxy resin precursor during the cross-linking process was investigated, in order to use such polyaramidic nanofibers for composite materials reinforcement. Hence nanofibrous PMIA mats were produced via electrospinning technique to be used for the functional modification of the epoxy matrix composite properties. When adding such fibers to an epoxy resin precursor, it was observed a strong influence on the kinetics of its curing process. The final results, however, demonstrates that boosting the reaction condition (raising the temperature and the reaction time) the curing is pushed to completion, indicating that the cross-linking process of the resin is just delayed and not completely hampered. It will be therefore necessary to rethink the composite cure cycle when PMIA nanofibers are added to the composite material, in order to attain significant improvement of the final composite performance.

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Periodical:

Key Engineering Materials (Volume 748)

Pages:

39-44

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.748.39

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Online since:

August 2017

Authors:

Stefano Merighi, Emanuele Maccaferri, Juri Belcari, Andrea Zucchelli, Tiziana Benelli, Loris Giorgini, Laura Mazzocchetti*

Keywords:

Composite, Cure Kinetics, Epoxy Resin, Nanofibers, Polyaramid

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