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HomeKey Engineering MaterialsKey Engineering Materials Vol. 784Thermal Shock Resistance of Si3N4/hBN Ceramic...

Thermal Shock Resistance of Si₃N₄/hBN Ceramic Composites

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Abstract:

Si₃N₄/hBN composites were fabricated by hot isostatic pressing at 1700°C/3h with 1, 3 and 5 wt. % micro-sized or nano-sized hexagonal boron nitride particles added to silicon nitride matrix. An indentation quench test method was used for estimation of thermal shock resistance of monolithic Si₃N₄ and Si₃N₄/hBN composites. Thermal shock resistance of the composites increased with the increase of size and volume of hBN particles. The critical temperature difference for the composites with micro-sized hBN was significantly higher (over 900°C) compared to the monolithic silicon nitride (580°C).

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Key Engineering Materials (Volume 784)

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73-78

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.784.73

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Online since:

October 2018

Authors:

Alexandra Kovalcikova*, Michal Húlan, Richard Sedlák, Martin Fides, Csaba Balázsi, Mária Mihaliková, Jan Dusza

Keywords:

Hexagonal Boron Nitride, Mechanical Properties, Silicon Nitride, Thermal Shock Resistance

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© 2018 Trans Tech Publications Ltd. All Rights Reserved

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