Fabrication of Al/Ni Multilayer Composite by Electrodeposition and Hot Press Bonding and Investigation of its Bending Property

Ming Zhi Wang; Liang Sheng Qiu; Liang Hu Cheng; Xiang Liu; Jian Shao; Xin Cao; Tao Sha Song; Han Tao Kou; Jie Tao

doi:10.4028/www.scientific.net/KEM.793.3

Paper Titles

Fabrication of Al/Ni Multilayer Composite by Electrodeposition and Hot Press Bonding and Investigation of its Bending Property
p.3

Natural-Fiber-Reinforced Polymer Composites for Automotive Parts Manufacturing
p.9

Grain Rotation during Twin-Detwin Deformation of Mg AZ31 Alloy Using In Situ XRD and EBSD
p.17

A Study on the Prediction and Comparison of Processing Using the Artificial Neural Network in Nitinol Electrochemical Machining
p.23

Effect of LaNiO₃ Buffer Layer on the Electrical and Optical Properties of Nonpolar ZnO Film Deposited on (100) Si Substrate
p.29

Efficiency Enhancement by Optimizing Selenization Time for Co-Sputtered Cu₂ZnSn(S,Se)₄ Thin Film Solar Cells
p.35

Influence of Wall Stocks on Mechanical Properties of HPDC AZ91
p.41

Effect of Amines Addition on Properties and Stability of PEGylated Au Nanoparticles
p.47

HomeKey Engineering MaterialsKey Engineering Materials Vol. 793Fabrication of Al/Ni Multilayer Composite by...

Fabrication of Al/Ni Multilayer Composite by Electrodeposition and Hot Press Bonding and Investigation of its Bending Property

Abstract:

The Al/Ni multilayer composite with highly exothermic reactions and good plasticity was fabricated by electrodeposition and hot press bonding process. The Al/Ni multilayer composite consisted of the microscale Al and Ni layers. The Ni layers were electroplated on Al foils for a certain time and DC current, and then a mounts of deposited foils were stacked and combined as a whole bulk Al/Ni multilayer composite. In this study, the microstructure evolution, phase transformation, exothermic heat and bending property of the Al/Ni multilayer composite during various hot press bonding were studied by SEM, XRD, DSC and bending test. Under the hot press bonding condition of 400°C and 1h, the exothermic heat, the bending strength and the bending displacement reached 916J/g, 614.5MPa and 4mm, respectively. The results showed that by the increasing time of hot press bonding, the bending displacement of the Al/Ni multilayer composite improved firstly and then declined sharply. It was also found that when the time of hot press bonding increased, the bending strength and the exothermic heat decreased simultaneously, owing to the nucleation and growth of the Al₃Ni phases in the interfaces between Al and Ni layers.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Key Engineering Materials (Volume 793)

Pages:

3-8

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.793.3

Citation:

Cite this paper

Online since:

January 2019

Authors:

Ming Zhi Wang*, Liang Sheng Qiu, Liang Hu Cheng, Xiang Liu, Jian Shao, Xin Cao, Tao Sha Song, Han Tao Kou, Jie Tao

Keywords:

Al/Ni Mulitilayer Composite, Bending Property, Electrodeposition, Hot Press Bonding

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] A. Duckham, S.J. Spey, J. Wang, et al.: Journal of Applied Physics Vol. 96(2004), p.2336.

Google Scholar

[2] K. Morsi: Materials Science and Engineering: A Vol. 299(2001), p.1.

Google Scholar

[3] A.I. Ustinov, S.A. Demchenkov: Intermetallics Vol. 84 (2017), p.82.

Google Scholar

[4] O.S. Lagoviyer, M. Schoenitz, E.L. Dreizin: Journal of Materials Science Vol. 53(2018), p.1178.

Google Scholar

[5] C. Ji, Y. He, C.T. Wang, , et al.: Materials and Design Vol. 116 (2017), p.591.

Google Scholar

[6] A.S. Rogachev: Russian Chemical Reviews Vol. 77(2008), p.21.

Google Scholar

[7] D.P. Adams: Thin Solid Films Vol. 576(2015), p.98.

Google Scholar

[8] R. Knepper, M.R. Snyder, G. Fritz, et al.: Journal of Applied Physics Vol. 105(2009), p.083504.

Google Scholar

[9] P. Bhattacharya, S. Bysakh, K.N. Ishihara, et al.: Scripta Materialia Vol. 44(2001), p.1831.

Google Scholar

[10] J.C. Trenkle, L.J. Koerner, M.W. Tate, et al.: Applied Physics Letters Vol. 93(2008), p.081903.

Google Scholar

[11] A.J. Gavens, D.V. Heerden, A.B. Mann, et al.: Journal of Applied Physics Vol.87(2000), p.1255.

Google Scholar

[12] U. Schoo, M. Hirscher, H. Mehrer: Defect and Diffusion Forum Vol. 143-147(1997), p.631.

DOI: 10.4028/www.scientific.net/ddf.143-147.631

Google Scholar