Investigation of Ni-Al Intermetallic Thin Films

Abstract:

The article describes the results of studies of Ni-Al ultrathin films obtained by the resistive thermal evaporation method and having the characteristic dimensions of islands of 700-1000 nm with a film thickness of about 500 nm. This paper presents a method of obtaining a film using a unit for creating high vacuum and the subsequent deposition of the film. The obtained film sample was studied using an optical microscope, a scanning probe microscope and a Fourier analyzer. The kinetic characteristics of the film, the film relief, and the characteristic dimensions of the islands were established; the search for regularities in the island structure of films was carried out and its electrical conductivity was determined.

• Periodical: Key Engineering Materials (Volume 854)
• Pages: 140-147
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.854.140
• Online since: July 2020
• Authors: Vladimir N. Malikov*, Alexey V. Ishkov, Alexey A. Grigorev, Denis A. Fadeev, Mihail A. Ryasnoi
• Keywords: Films, Intermetallic Thin Films, Kinetic Characteristics, Ni-Al Alloys

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