Analysis of Micro Structure and the Resistivity of Cu / Ni Thin Coat as a Low Temperature Sensor Using Electroplating Method Assisted with Magnetic Field outside of the Ion Flow

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Preservation of materials using liquid nitrogen media has been widely used. One of them is used in the medical field, namely cryonic technology. Cryonics is a method of preservation at cold temperatures using a cryoprotectant in liquid nitrogen. To maintain the quality of the material, a sensor that can detect the temperature of liquid nitrogen is needed. Low temperature sensors with Cu and Ni based Resistance Temperature Detector with layers (RTD) have been made, but these sensors have a layer of Ni deposits that are not yet homogeneous. So quality improvement is needed by adding an external magnetic field. Based on this, the aim of this research is to synthesize a thin layer of Cu / Ni using electroplating method assisted by external magnets parallel to the ion currents

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141-147

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May 2021

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© 2021 Trans Tech Publications Ltd. All Rights Reserved

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[1] J. Fraden, Handbook of Modern Sensors,, New York: Springer, (2015).

Google Scholar

[2] N. Afsarimanesh, and P. Z. Ahmed, Labview Based Characterization and Optimization of Thermal Sensors,, International journal on smart sensing and intelligent systems, 4(4).

DOI: 10.21307/ijssis-2017-466

Google Scholar

[3] J. Aissa, J. Boos, C. Schleich, M. Sedlmair, K.M. Krzymyk, P. Kröpil, G. Antoch, C. Thomas,Metal Artifact Reduction in Computed Tomography After Deep Brain Stimulation Electrode Placement Using Iterative Reconstructions,, Investigative Radiology. 52(1) (2017).

DOI: 10.1097/rli.0000000000000296

Google Scholar

[4] N. Okamoto, and T. Watanabe, The Adhesion of Electrodeposited Copper, Nickel and Silver Films on Copper, Nickel and Silver Substrates,, Nippon Kinzoku Gakkaishi/Journal Japan Inst. Met., 68(2) 110–113, (2009).

DOI: 10.2320/jinstmet.68.110

Google Scholar

[5] J. Fraden, Handbook of Modern Sensors,, New York: Springer, (2015).

Google Scholar

[6] S. Kumar, S. Pande, and P. Verma, International Journal of Current Engineering and Technology Factor Effecting Electro-Deposition Process,, Int. J. Curr. Eng. Technol., 5(2) (2015).

Google Scholar

[7] Y. X. Zhou, L. Sun, X. Chen, H. Fang, P. T. Putman, and K. Salama, The manufacturing of an electroplated Ni layer on textured Cu substrate for Cu-based HTS coated conductors,, Supercond. Sci. Technol., 18(1) 107–111, (2009).

DOI: 10.1088/0953-2048/18/1/017

Google Scholar

[8] Z. An, L. He, M. Toda, G. Yamamoto, T. Hashida, and T. Ono, Microstructuring of carbon nanotubes-nickel nanocomposite,, Nanotechnology, 26(19) 195601, (2015).

DOI: 10.1088/0957-4484/26/19/195601

Google Scholar

[9] C. H. Ketthanom, and R. Phattanakun, Investigation of incrush in nickel microfuses,, IOP Conf. Seriesmaterial science and engineering, 241. Ser. 012033. (2017).

DOI: 10.1088/1757-899x/241/1/012033

Google Scholar

[10] Y. X. Zhou, L. Sun, X. Chen, H. Fang, P. T. Putman, and K. Salama, The manufacturing of an electroplated Ni layer on textured Cu substrate for Cu-based HTS coated conductors,, Supercond. Sci. Technol., 18(1) 107–111, (2009).

DOI: 10.1088/0953-2048/18/1/017

Google Scholar

[11] Y. Wang, C. Zhang, J. Li, G. Ding, and L. Duan, Fabrication and characterization of ITO thin film resistance temperature detector,, Vacuum, 140 121–125, (2017).

DOI: 10.1016/j.vacuum.2016.07.028

Google Scholar

[12] B. Yang and X. He, Experimental Investigation of Surface Color Changes in Vacuum Evaporation Process for Gold-like Stainless Steel,, 4. 3–7.

Google Scholar

[13] W. Wu, N. Eliaz, and E. Gileadi, The Effects of pH and Temperature on Electrodeposition of Re-Ir-Ni Coatings from Aqueous Solutions,, J. Electrochem. Soc., 162(1) D20–D26, (2014).

DOI: 10.1149/2.0281501jes

Google Scholar

[14] M. Toifur, Y. Yuningsih, and A. Khusnani, Microstructure, thickness and sheet resistivity of Cu / Ni thin film produced by electroplating technique on the variation of electrolyte temperature Microstructure , thickness and sheet resistivity of Cu / Ni thin film produced by electroplating techniq,, IOP Conf. Ser. J. Phys. Conf. Ser. 997 012053, (2018).

DOI: 10.1088/1742-6596/997/1/012053

Google Scholar

[15] O. Aaboubi, K. Msellak, Magnetic field effects on the electrodeposition of CoNiMo alloys,, Applied Surface Science 396 (2017) 375–383.

DOI: 10.1016/j.apsusc.2016.10.164

Google Scholar