Evaluation of Interfacial Thermal Resistance of Al-Si Alloy by Using Image-Based Simulation

Kenjiro Sugio; Tomoyasu Ishii; Gen Sasaki

doi:10.4028/p-sF2kbX

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Evaluation of Interfacial Thermal Resistance of Al-Si Alloy by Using Image-Based Simulation
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 968Evaluation of Interfacial Thermal Resistance of...

Evaluation of Interfacial Thermal Resistance of Al-Si Alloy by Using Image-Based Simulation

Abstract:

Interfacial thermal resistances of Al-Si alloys were evaluated by comparing the measured thermal conductivities and the simulated thermal conductivities. Al-7%Si, Al-18%Si and Al-18%Si held in the solid-liquid coexistence temperature for 90 minutes were fabricated by gravity casting. Thermal conductivities were measured with the steady state thermal conductivity measuring device. Thermal conductivities were also simulated by using optical microscope images. Comparing the measured thermal conductivities and the simulated thermal conductivities, interfacial thermal resistances in Al-Si interfaces were evaluated as about 2.5-4.8×10^-9 m²K/W.

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Periodical:

Key Engineering Materials (Volume 968)

Pages:

87-91

DOI:

https://doi.org/10.4028/p-sF2kbX

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Online since:

December 2023

Authors:

Kenjiro Sugio*, Tomoyasu Ishii, Gen Sasaki

Keywords:

Gravity Casting, Image Analysis, Interfacial Thermal Resistance, Thermal Conductivity

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* - Corresponding Author

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