Aspects Regarding FSW and SFSW Welding of Copper Cu99

Abstract:

Copper is used in various industrial fields due to its characteristics and properties. The very high thermal conductivity of copper makes it difficult to weld it using conventional fusion welding processes. Friction stir welding FSW is a solid-state joining process of metallic materials, which can be used to perform copper welded joints. Using a liquid working environment in FSW welding (submerged friction stir welding SFSW) causes the decrease of the process temperature, which can be beneficial for copper. The paper presents aspects and results obtained by ISIM Timisoara regarding FSW and SFSW butt welding of copper Cu99 2.5 mm thick, using the same type of the welding tool. The obtained results will be useful for the start of the experimental researches of processing in air and in liquid environment FSP and SFSP of copper Cu99, which will be performed in the Nucleu PN 23 37 01 02 project underway at ISIM Timisoara.

• Periodical: Key Engineering Materials (Volume 992)
• Pages: 75-82
• DOI: https://doi.org/10.4028/p-j0yFAx
• Online since: October 2024
• Authors: Lia-Nicoleta Botila*, Ion Aurel Perianu, Matei Marin-Corciu, Emilia-Florina Binchiciu, Iuliana Duma, Radu Nicolae Popescu
• Keywords: Copper Cu99, Friction Stir Welding, FSW/SFSW Welding Experiments, Submerged Friction Stir Welding

References

[1] M. A. Wahid and A.N. Siddiquee: Trans. Nonferrous Met. Soc., Vol.28(2) (2018), p.193–219

DOI: 10.1016/S1003-6326(18)64653-9

[2] D. Paramaguru, S. Rao Pedapati and M. Awang, in: Lect. Notes Mech. Eng., edited by F. Chaari, F. Gherardini, V. Ivanov, M. Haddar, Springer, Singapore (2018)

DOI: 10.1007/978-981-10-9041-7_6

[3] C. Rathinasuriyan, E. Pavithra, R. Sankar and V.S.S. Kumar: Int. J. Pr. Eng. Man-GT, Vol.8 (2020), pp.687-701

DOI: 10.1007/s40684-020-00187-6

[4] N. Ethiraj, S. Meikeerthy and T. Sivabalan: Eng. Appl. Sci. Res. Vol. 47 (1) (2020), pp.111-116, https://

[5] M. M. El-Sayed, A.Y. Shash, M. Abd-Rabou and M. G. ElSherbiny: J. Adv. Join. Process. Vol.3 (2021), 100059

DOI: 10.1016/j.jajp.2021.100059

[6] M. Sadeghi, M. Farahani and H. Sabet: JEFM, Vol. 7 (1) (2023), pp.01-06, https://jefm.karaj.iau.ir/article_702829.html

[7] M. M. Z. Ahmed, M.M. El-Sayed Seleman, D. Fydrych and G. Çam: Materials Vol. 16(8) (2023), 2971, https:// doi.org/

DOI: 10.3390/ma16082971

[8] R. Bhattacharjee, S. Datta, T. Medhi and P. Biswas, in: Sustainable Smart Manufacturing Processes in Industry 4.0, pp.183-213, edited by R. Kumar, A. Prasad and A. Kumar, CRC Press, Taylor & Francis Group, Boca Raton (2023)

DOI: 10.1201/9781003436072

[9] M. Akbari, P. Asadi and T. Sadowski: Materials Vol. 16 (2023), 5890

DOI: 10.20944/preprints202307.1296.v1

[10] B. Vinith, S. A. D. Dharshan, S. Aravind et al.: Int. J. Interact. Des. Manuf. Vol.17 (2023), p.1443–1458

DOI: 10.1007/s12008-023-01208-9

[11] E. Kaygusuz, F. Karaomerlıoglu and S. Akıncı: Turk. J. Eng. Vol. 7 (4) (2023), pp.286-295

DOI: 10.31127/tuje.1107210

[12] S. Verma, V. Kumar, R. Kumar and R. Singh Sidhu: Mater. Today: Proc. Vol. 50 (2022), pp.1032-1042

DOI: 10.1016/j.matpr.2021.07.449

[13] M. Sajid, G. Kumar and M. Kumar: IJREI Vol.7(1) (2023), pp.15-22

[14] N. Ethiraj, T Sivabalan, S. Meikeerthy, K. L. V. R. Kumar, G. Chaithanya and G. P. K. Reddy: AIP Conf. Proc. 2128, (2019), 030003, pp.1-8;

DOI: 10.1063/1.5117946

[15] Y. Sun, W. Gong, R. Zhu, Y. Li and S. Sun: Metall. Res. Technol. Vol.120 (3) (2023), 309

DOI: 10.1051/metal/2023011

[16] S. Budin, K. M. Hyie and N. C. Maideen: Jurnal Tribologi Vol.32 (2022), pp.69-78

[17] P. Xue, B.L. Xiao, Q. Zhang and Z. Y. Ma: Scr. Mater. Vol.64 (11) (2011), p.1051–1054

DOI: 10.1016/j.scriptamat.2011.02.019

[18] H. Papahn, P. Bahemmat, M. Haghpanahi and C. Sommitsch: Int J Adv Manuf Technol, Vol. 78, (2015), p.1101–1111

DOI: 10.1007/s00170-014-6615-8

[19] A. N. Rao, L. S. Naik and C. Srinivas: Mater. Today: Proc. Vol. 4(2) (2017), p.1225–1229

DOI: 10.1016/j.matpr.2017.01.141

[20] H. Pashazadeh, J. Teimournezhad and A. Masoumi: Int. J. Adv. Manuf. Technol. Vol.88 (2017), p.1961–1970.

DOI: 10.1007/s00170-016-8913-9