Key Engineering Materials
This collection of more than 204 peer-reviewed papers on Composite Science and Technology covers: mechanics of composites, infrastructural composites, non-destructive evaluation and characterization of composites, fracture and fatigue of composites, numerical and mathematical modelling, ceramic matrices, composites, metal-matrix composites, composite manufacturing, polymer composites, smart materials and structures, nano-composites, bio-composites and structural health monitoring. This makes it a handy guide to the state-of-the-art of this field.
Silicon ultra-large scale integrated circuits (ULSIs) are now faced with various physical limits to further scaling. Therefore, it is very important to establish the fundamental science and technology required to produce nano-scale complementary metal-oxide-semiconductor devices (Nano-CMOS) having high performance, new functionalities and larger-scale integration. The scope of this book covers: - Nano-scale complementary metal-oxide-semiconductor devices (Nano-CMOS), - Novel functional devices, materials, and nanoprocessing technologies, - Nano-bio physics and technologies for future nano devices, - Variability control technologies and Signal integrity. This makes it a very useful handbook on the subject.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The more than 387 papers are grouped into: Chapter 1: Intelligent Mechatronics, Robotics, Biomimetics, Automation, Chapter 2: Materials, Mechatronics and Automation, Chapter 3: Industrial Automation and Manufacturing Process.
The field of “polymers in concrete” is rather well consolidated within the construction industry, and its future will be one of benefiting fully from the synergy between the organic and mineral materials. Concrete-polymer composites (C-PC) exhibit excellent adhesion strength and durability in aggressive environments and the good performance of these materials makes innovative applications possible; including new technologies for restoring and renovating buildings.
This work brings together peer-reviewed papers on innovations and practical suggestions with regard to engineering & technology; materials science and technology in manufacturing including artificial materials, forming, novel-material fabrication, green manufacturing, design and manufacturing of composite components, surface science and engineering, quality control of manufacturing systems, theoretical, simulation and experimental studies related to microstructures and residual stresses; manufacturing systems and technologies including manufacturing process simulation, CIMS and manufacturing systems, vibration measuring and reliability analysis, finite element analysis and structure optimization, fault diagnosis and maintenance theory, intelligent mechatronics and robotics, elements, structures, mechanisms, and applications of micro and nano systems, compound machine tools, rapid prototyping, printing (e.g. embossing), complex mechanical-electro-liquid systems, PDM, ERP, CRM, FMS, PLM, logistics and supply chains, effect of the machining method or technique upon resultant material mechanical properties, RPM, and management.
This two-volume set of 339 peer-reviewed papers covers the broad areas of Composite, Polymer and Ceramic Materials, Fracture Mechanics and Mechanisms, Materials, Mechanical Structure, Strength and Dynamics, Interface Failure and Failure Analysis, Nano-Mechanics and Structures, Damage and Failure, Structural Design and Optimisation, Fatigue and Crack Propagation, Materials Modelling and Computation, Concrete, Rock and Soil, Dynamic Fracture and Impact, Erosion and Corrosion, Smart Materials and Structures, Biomechanics and Other Novel Methods of Computer Modelling in Engineering and Science.
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The scope of these proceedings encompasses: “Materials Science,” “Chemical Science and Technology,” “Nano-Science and Technology,” “Photonics Devices and Technology,” “Novel Measurement and System Technology,” and “Information and Communication Engineering.”
The present volume consists of a collection of peer-reviewed papers covering manufacturing process simulation, vibration measurement and reliability analysis, finite element analysis and structure optimization, fault diagnosis and maintenance theory, complex mechanical-electro-liquid systems, effect of machining methods or techniques upon material mechanical properties (such as their effect upon stress states, fatigue resistance, etc.), quality control of manufacturing systems, and so on.