Preparation and Characterization of a Low Density and Low Pressure Sheet Molding Compound

Abstract:

Low Density and Low Pressure Sheet Molding Compounds (LD-LPMC) were prepared by using magnesium oxide paste and crystalline polyester as thickening system to reduce molding pressure and Hollow Glass Microspheres (HGM) as fillers to reduce the density. The molding pressure of LD-LPMC was investigated. The effects of HGM content (0%, 3.8%, 7.6%, 11.4%, 15.2%, 19.0%) on the density, flexural strength and thermal conductivity of LD-LPMC were studied. The results showed that 2-4Mpa was the best molding pressure for the composite materials. With the increase of HGM content, the density, flexural strength and thermal conductivity of LD-LPMC decreased. The thermal conductivity increased with the increase of temperature. When the molding pressure was 3Mpa and the content of the HGM was 7.6%, the density decreased by 13.6%, the flexural strength only decreased by 23.3% and the thermal conductivity (40°C) also decreased by 11.5%, which reflected the low density, high strength and good thermal insulation performance of LD-LPMC.

• Periodical: Materials Science Forum (Volume 1003)
• Pages: 98-105
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.1003.98
• Online since: July 2020
• Authors: Min Xian Shi, Chuang Dong, Yong Zhang, Zhi Xiong Huang*
• Keywords: Hollow Glass Microspheres, Low Density, Low Pressure, SMC, Thermal Conductivity

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