Preparation and Characteristic of Ultrafine Copper-Based Powders Reduced by a Two-Step Reduction Method

Abstract:

In this study, the ultrafine copper-based powders were fabricated by a facile two-step chemical reduction method. Glucose (C₆H₁₂O₆) and ascorbic acid (AA) were taken as a pre-reductant and a second reductant, respectively. Polyvinylpyrrolidone (PVP) was applied as the capping agent. Effects of parameters, such as glucose content, PVP content and PH value on the ultimate reduction products were analyzed. Microstructure and composition of the products were characterized by scanning electron microscope (SEM), transmission electron microscope (TEM) and X-ray diffraction (XRD). It was found that when the amount of glucose was increased from half to full and then excessive, the powder gradually changed from flaky to spherical, from pure copper powder to a mixture of copper and cuprous oxide (Cu₂O). With the amount of PVP increasing from 0g to 0.64 g, the shape of the pure copper powder changed from cubic to spherical or HYPERLINK "javascript:void (0);" icosahedron. When the PH value changed from 10-14, the powder changed from spherical to regular octahedron and Irregular polyhedron, from pure copper powder to pure cuprous oxide powder. Therefore, copper-based powders with different morphologies and different compositions can be prepared by changing PH value and the amount of reductant.

• Periodical: Materials Science Forum (Volume 1003)
• Pages: 122-127
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.1003.122
• Online since: July 2020
• Authors: Jia Yuan Chang, Ru Yue Guo, Mu Hua Li, Hua Yi Li*
• Keywords: Ascorbic Acid, Glucose, Two-Step Chemical Reduction Method, Ultrafine Copper-Based Powders

References

[1] M.J. Yim, Y. Li, K.S. Moon, C.P. Wong, Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives, J. Electron. Mater. 36(10) (2007) 1341-1347.

DOI: 10.1007/s11664-007-0204-7

[2] A.V. Lyasnikova, O.A. Dudareva, O.A. Markelova, I.P. Grishina, V.N. Lyasnikov, Plasma biocomposite coatings based on copper substituted calcium phosphates, Prikladnaya fizika (2) (2018) 75-79.

DOI: 10.22226/2410-3535-2018-2-202-207

[3] J.F. Zhang, T. Goto, Fabrication of Al2O3-Cu Nanocomposites Using Rotary Chemical Vapor Deposition and Spark Plasma Sintering, J. Nanomater. (2015) 7.

DOI: 10.1155/2015/790361

[4] P. Balaz, E. Godocikova, E. Boldizarova, M. Luxova, Z. Bastl, J. Jiang, Characterization of nanocrystalline products prepared by mechanochemical reduction of copper sulphide, Czech. J. Phys. 52 (2002) A65-A68.

DOI: 10.1007/s10582-002-0014-3

[5] P. Balaz, E. Boldizarova, E. Godocikova, Preparation of nanocrystalline copper and copper silicon sulphide by mechanochemical route, in: A. MendezVilas (Ed.), Cross-Disciplinary Applied Research In Materials Science And Technology, Trans Tech Publications Ltd, Zurich-Uetikon, 2005, pp.453-456.

[6] F. Shehata, M. Abdelhameed, A. Fathy, S.F. Moustafa, Fabrication of Copper-Alumina Nanocomposites by Mechanochemical Routes, J. Nano Res. 6 (2009) 51-60.

DOI: 10.4028/www.scientific.net/jnanor.6.51

[7] W.C. Hu, L. Zhu, D. Dong, W. He, X.Z. Tang, X.B. Liu, Thermal behavior of copper powder prepared by hydrothermal treatment, J. Mater. Sci.-Mater. Electron. 18(8) (2007) 817-821.

DOI: 10.1007/s10854-007-9257-x

[8] S.P. Wu, J. Ni, L. Jiao, Z.N. Zeng, Preparation of ultra-fine copper-nickel bimetallic powders with hydrothermal-reduction method, Mater. Chem. Phys. 105(1) (2007) 71-75.

DOI: 10.1016/j.matchemphys.2007.04.027

[9] W. Wang, G.C. Li, Z.K. Zhang, A facile templateless, surfactantless hydrothermal route to ultralong copper submicron wires, J. Cryst. Growth 299(1) (2007) 158-164.

DOI: 10.1016/j.jcrysgro.2006.11.221

[10] M. Bicer, I. Sisman, Controlled synthesis of copper nano/microstructures using ascorbic acid in aqueous CTAB solution, Powder Technol. 198(2) (2010) 279-284.

DOI: 10.1016/j.powtec.2009.11.022

[11] Y.L. Li, Z.Y. Li, Y.F. Luo, B.H. Li, Study on preparation of CNTs-Cu composites materials by hydrazine hydrate reduction-solid state sintering process, Ferroelectrics 521(1) (2017) 32-37.

DOI: 10.1080/00150193.2017.1390992

[12] S. Cho, Z. Yin, Y.K. Ahn, Y. Piao, J. Yoo, Y.S. Kim, Self-reducible copper ion complex ink for air sinterable conductive electrodes, J. Mater. Chem. C 4(45) (2016) 10740-10746.

DOI: 10.1039/c6tc04145k