Effect of Stress Gradient on Heat Cycle Fatigue Life Prediction of Solder Joints by Repetitive Bending Test

Abstract:

Strength of solder joints is usually evaluated by a shear test and a pull test. The reliability of the solder joint is evaluated by the repetitive pull tests of solder bulk specimens. However, the stress and strain field that caused by thermal load on the solder joint of the product model for estimating the reliability is different from these tests. Therefore, we proposed a repetitive bending test as a reliability test of solder joints producing the stress and strain field caused at the solder joint of product model. We proposed a repetitive multi-point bending test as a method to predict the fatigue life of the solder joint in the thermal cycle test in a short period of time. The influence of strain gradient on the inelastic strain amplitude used for lifetime evaluation is estimated. The controllability of the strain gradient by the three-point bending test parameters is investigated. The effect of residual stress on inelastic strain amplitude during sample preparation for thermal cycle test is also evaluated.

• Periodical: Materials Science Forum (Volume 1016)
• Pages: 875-881
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.1016.875
• Online since: January 2021
• Authors: Michiya Matsushima*, Kei Endo, Tetsuya Kawazoe, Shinji Fukumoto, Kozo Fujimoto
• Keywords: Lifetime Evaluation, Repetitive Bending Test, Solder Joint, Stress Gradient

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