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HomeMaterials Science ForumMaterials Science Forum Vol. 1027Research Progress in the Preparation of Flexible...

Research Progress in the Preparation of Flexible Substrate Barrier Films

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Abstract:

The development of flexible electronics towards for the direction of bend ability, lightweight, portability, long life against falling. The performance of the substrate in the flexible electronics plays a very important role in the development of electronics. In this article, three preparation technologies of thin films are introduced, including CVD, PVD and ALD. The paper also introduces the research progress on the preparation of substrate barrier films, and one main challenge that may face by the preparation of thin film materials. In order to satisfy the development of flexible electronics, improving the substrate’s performance constantly is needed. Finally, the development of preparing barrier films is prospected.

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Materials Science and Manufacturing Engineering

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Periodical:

Materials Science Forum (Volume 1027)

Pages:

91-98

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.1027.91

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Online since:

April 2021

Authors:

Li Xia Guan*, Zhao Yi Zhou, Yi Jing Huang

Keywords:

Atomic Layer Deposition, Barrier Films, Chemical Vapor Deposition, Flexible Electronics, Physical Vapor Deposition

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© 2021 Trans Tech Publications Ltd. All Rights Reserved

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* - Corresponding Author

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