Observation of Mode I Crack Growth Behavior in 4.762 mm Diameter-Silicon Nitride Ball under Compressive-Tensile Cyclic Loadings

Abstract:

Cyclic pressure fatigue tests of silicon nitride ball were performed in two phases. In the first phase, compressive and tensile stresses were applied to two cracks on the ball surface, respectively. In the second phase, tensile stress was applied to the crack that was applied to compressive stress in the first phase to grow. The effect of cyclic compressive stress on crack growth was investigated through this series of tests. The results are as follows. The ball did not fracture in either Phase 1 or Phase 2 tests. The crack did not propagate when the maximum compressive load of approximately 5 kN was repeatedly applied across the crack surface. In addition, the crack applied with compressive stress before tensile stress, and the crack which was not, both grew to about 520 μm during N ranging from 0 to 1.2×10⁷ fatigue cycles. The crack applied with compressive stress before tensile stress at fatigue cycles N = 10³ grew about 170 μm longer than the crack to which stress was not applied.

• Periodical: Materials Science Forum (Volume 1085)
• Pages: 157-162
• DOI: https://doi.org/10.4028/p-91zhb7
• Online since: April 2023
• Authors: Ryota Hayashi*, Yasuharu Hobo, Koshiro Mizobe, Takahiro Matsueda, Katsuyuki Kida
• Keywords: Ball, Fatigue Crack Growth, Mode I, Silicon Nitride

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