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HomeMaterials Science ForumMaterials Science Forum Vols. 204-206Influences of Tin and Copper on the Inhibitor...

Influences of Tin and Copper on the Inhibitor Intensities in High-Induction Grain-Oriented Silicon Steel

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Grain Growth in Polycrystalline Materials II

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Periodical:

Materials Science Forum (Volumes 204-206)

Pages:

641-646

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.204-206.641

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Online since:

March 1996

Authors:

Yongbing Zhao, Z. He, Y. Weng, B. Wu

Keywords:

Aluminum Nitride (AlN), Copper (Cu), Grain Boundary Segregation, Grain Oriented Silicon Steel, Inhibitor, Sulphide Particle, Titanium Nitride TiN

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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