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HomeMaterials Science ForumMaterials Science Forum Vols. 207-209Tight-Binding Calculation of Grain Boundaries in...

Tight-Binding Calculation of Grain Boundaries in Diamond

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Intergranular and Interphase Boundaries in Materials II

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Periodical:

Materials Science Forum (Volumes 207-209)

Pages:

261-264

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.207-209.261

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Online since:

February 1996

Authors:

Masanori Kohyama, Hideki Ichinose, Yuuki Ishida, M. Nakanose

Keywords:

Atomic Structure, Coincidence Boundary, Diamond Thin Film, Electronic Structure, Interfacial Energy, Tight-Binding Method

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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