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HomeMaterials Science ForumMaterials Science Forum Vols. 207-209Stress Distribution and Mass Transport along Grain...

Stress Distribution and Mass Transport along Grain Boundaries during Electromigration

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Intergranular and Interphase Boundaries in Materials II

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Periodical:

Materials Science Forum (Volumes 207-209)

Pages:

457-460

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.207-209.457

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Online since:

February 1996

Authors:

X. Chu, M. Scherge, C.L. Bauer, W.W. Mullins

Keywords:

Electromigration, Grain Boundary, Mass Transport, Stress Distribution

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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