Powder Diffraction Simulation in the CAD of Multicomponenet Systems
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The Effect of Impurities on X-Ray Compton Scattering in Belite
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Study of the Growth of Thin Expitaxial CVD Diamond Films on Silicon
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Residual Stress in Diamond Coatings by Synchrotron Radiation XRD
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Grain Size Analysis in Electrodeposited Cu-Coatings
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On the Thickness-Dependence of Textures in Electrodeposited Copper-Coatings
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p.463
Variation of Preferred Orientation of Erbium Thin Films with Temperature and Substrate
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Microstructure Formation in Electrodeposition of Highly Supersaturated Cu-Pb and Ag-Pb Layers
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Residual Stress in Plasma-Sprayed Ceramic Coatings
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Grain Size Analysis in Electrodeposited Cu-Coatings
Abstract:
Info:
Periodical:
Materials Science Forum (Volumes 228-231)
Main Theme:
Edited by:
R.J. Cernik, R. Delhez and E.J. Mittemeijer
Pages:
457-462
Citation:
S. Schläfer et al., "Grain Size Analysis in Electrodeposited Cu-Coatings", Materials Science Forum, Vols. 228-231, pp. 457-462, 1996
Online since:
July 1996
Authors:
Price:
$38.00
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