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HomeMaterials Science ForumEuropean Powder Diffraction 4Grain Size Analysis in Electrodeposited...

Grain Size Analysis in Electrodeposited Cu-Coatings

Abstract:

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Info:

Periodical:

Materials Science Forum (Volumes 228-231)

Main Theme:

European Powder Diffraction 4

Edited by:

R.J. Cernik, R. Delhez and E.J. Mittemeijer

Pages:

457-462

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.228-231.457

Citation:

S. Schläfer et al., "Grain Size Analysis in Electrodeposited Cu-Coatings", Materials Science Forum, Vols. 228-231, pp. 457-462, 1996

Online since:

July 1996

Authors:

S. Schläfer, P. Klimanek, I. Handreg, G. Heinzel, G. Lanza

Keywords:

Electrolytic Cu-Coatings, Grain Size Analysis, Scanning Electron Microscope (SEM), TEM, X-Ray Diffraction (XRD)

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$38.00

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