Grain Size Analysis in Electrodeposited Cu-Coatings

Schläfer, S.; Klimanek, P.; Handreg, I.; Heinzel, G.; Lanza, G.

doi:10.4028/www.scientific.net/MSF.228-231.457

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Paper Title:

Grain Size Analysis in Electrodeposited Cu-Coatings

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Periodical

Materials Science Forum (Volumes 228-231)

Main Theme

European Powder Diffraction 4

Edited by

R.J. Cernik, R. Delhez and E.J. Mittemeijer

Pages

457-462

DOI

10.4028/www.scientific.net/MSF.228-231.457

Citation

S. Schläfer, P. Klimanek, I. Handreg, G. Heinzel, G. Lanza, "Grain Size Analysis in Electrodeposited Cu-Coatings", Materials Science Forum, Vols. 228-231, pp. 457-462, 1996

Online since

July 1996

Authors

S. Schläfer, P. Klimanek, I. Handreg, G. Heinzel, G. Lanza

Keywords

Electrolytic Cu-Coatings, Grain Size Analysis, Scanning Electron Microscope (SEM), TEM, X-Ray Diffraction (XRD)

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