Crystal Texture and Electromigration Damage in Al-Based Interconnect Lines Studied by ACOM with the SEM

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Periodical:

Materials Science Forum (Volumes 273-275)

Edited by:

R.A. Schwarzer

Pages:

573-580

DOI:

10.4028/www.scientific.net/MSF.273-275.573

Citation:

M. Lepper et al., "Crystal Texture and Electromigration Damage in Al-Based Interconnect Lines Studied by ACOM with the SEM", Materials Science Forum, Vols. 273-275, pp. 573-580, 1998

Online since:

February 1998

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$35.00

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