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HomeMaterials Science ForumMaterials Science Forum Vols. 273-275Crystal Texture and Electromigration Damage in...

Crystal Texture and Electromigration Damage in Al-Based Interconnect Lines Studied by ACOM with the SEM

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Periodical:

Materials Science Forum (Volumes 273-275)

Pages:

573-580

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.273-275.573

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Online since:

February 1998

Authors:

M. Lepper, A. von Glasow, D. Piscevic, Robert A. Schwarzer

Keywords:

ACOM, Aggregate Function, Aluminum (Al), BKD, Electromigration, Electron Backscatter Diffraction (EBSD), Thin Film

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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