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HomeMaterials Science ForumMaterials Science Forum Vols. 289-292Ellipsometric Characterization of Copper Deposits

Ellipsometric Characterization of Copper Deposits

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Electrochemical Methods in Corrosion Research VI

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Periodical:

Materials Science Forum (Volumes 289-292)

Pages:

465-470

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.289-292.465

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Online since:

August 1998

Authors:

G. Sandmann, W.J. Plieth, G.I. Lacconi, M. López Teijelo

Keywords:

Additive, Anisotropy, Copper Deposition, Ellipsometry

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© 1998 Trans Tech Publications Ltd. All Rights Reserved

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