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Models for Grain Boundary Diffusion in Thin Films Under Stress Fields in Different Kinetic Regimes
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Grain Boundary Self-Diffusion of Alloy 800 as Affected by Sulphur, Phosphorous and Carbon
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Computer Programs for Simulation of Growth Multiphase Diffusion Layers
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Short-Circuit Diffusion of ⁵¹Cr and ⁵⁹Fe in Nickel-Aluminium Intermetallics
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HomeMaterials Science ForumMaterials Science Forum Vols. 294-296Grain-Boundary Diffusion of Bi in Cu Bicrystals

Grain-Boundary Diffusion of Bi in Cu Bicrystals

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Intergranular and Interphase Boundaries in Materials III

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Periodical:

Materials Science Forum (Volumes 294-296)

Pages:

561-564

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.294-296.561

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Online since:

November 1998

Authors:

R. Monzen, T. Okamoto

Keywords:

[001] Symmetric Tilt Boundary, [001] Twist Boundary, [011] Twist Boundary, Bi, Boundary Diffusion, Boundary Energy, Cu Bicrystal

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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