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HomeMaterials Science ForumMaterials Science Forum Vols. 294-296Models for Grain Boundary Diffusion in Thin Films...

Models for Grain Boundary Diffusion in Thin Films Under Stress Fields in Different Kinetic Regimes

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Intergranular and Interphase Boundaries in Materials III

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Periodical:

Materials Science Forum (Volumes 294-296)

Pages:

553-556

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.294-296.553

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Online since:

November 1998

Authors:

Anatoly S. Ostrovsky, N. Balandina, Boris S. Bokstein

Keywords:

Diffusion, Grain Boundary, Stress, Thin Film

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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