The Role of the Triple Junctions During Grain Growth
p.521
p.521
The Propagation of Crystalline-Amorphous Interface: Experiment and Model
p.525
p.525
The Effect of Annealing Texture on Orientation Correlations in Copper
p.529
p.529
Normal and Abnormal Grain Growth in Tungsten Polycrystals
p.533
p.533
Effect of Surface Diffusion on the Contact Formation and Adhesion of Atomically-Clean Surfaces of Lead, Tin and Pb-Sn Eutectic Alloy
p.537
p.537
Radiotracer Diffusion of Ni and Ag in Ag and Ni Grain Boundaries and Oriented Ag/Ni Interphase Boundaries
p.541
p.541
Germanium Tracer Diffusion in a Series of Symmetrical Near Σ=7, Θ=38.2° [111] Tilt Grain Boundaries of Aluminum
p.545
p.545
Equilibrium Sites Occupied in the Grain Boundary Core During Intercrystalline Diffusion of 57Co in Metal Polycrystals
p.549
p.549
Models for Grain Boundary Diffusion in Thin Films Under Stress Fields in Different Kinetic Regimes
p.553
p.553
Effect of Surface Diffusion on the Contact Formation and Adhesion of Atomically-Clean Surfaces of Lead, Tin and Pb-Sn Eutectic Alloy
Abstract:
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Periodical:
Materials Science Forum (Volumes 294-296)
Pages:
537-540
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Online since:
November 1998
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© 1999 Trans Tech Publications Ltd. All Rights Reserved
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