Paper Titles

Grain Structure Evolution in 1-d Rods and 2-d Strips of Polycrystalline Aluminium
p.513

Effect of Triple Junctions on Grain Boundary Migration
p.517

The Role of the Triple Junctions During Grain Growth
p.521

The Propagation of Crystalline-Amorphous Interface: Experiment and Model
p.525

The Effect of Annealing Texture on Orientation Correlations in Copper
p.529

Normal and Abnormal Grain Growth in Tungsten Polycrystals
p.533

Effect of Surface Diffusion on the Contact Formation and Adhesion of Atomically-Clean Surfaces of Lead, Tin and Pb-Sn Eutectic Alloy
p.537

Radiotracer Diffusion of Ni and Ag in Ag and Ni Grain Boundaries and Oriented Ag/Ni Interphase Boundaries
p.541

Germanium Tracer Diffusion in a Series of Symmetrical Near Σ=7, Θ=38.2° [111] Tilt Grain Boundaries of Aluminum
p.545

HomeMaterials Science ForumMaterials Science Forum Vols. 294-296The Effect of Annealing Texture on Orientation...

The Effect of Annealing Texture on Orientation Correlations in Copper

Article Preview

Abstract:

You might also be interested in these eBooks

Intergranular and Interphase Boundaries in Materials III

Info:

Periodical:

Materials Science Forum (Volumes 294-296)

Pages:

529-532

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.294-296.529

Citation:

Cite this paper

Online since:

November 1998

Authors:

O.V. Mishin

Keywords:

Copper (Cu), Grain Boundary Misorientation Distribution, Orientation Correlation, Texture

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 1999 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: