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HomeMaterials Science ForumMaterials Science Forum Vols. 294-296The Role of the Triple Junctions During Grain...

The Role of the Triple Junctions During Grain Growth

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Intergranular and Interphase Boundaries in Materials III

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Periodical:

Materials Science Forum (Volumes 294-296)

Pages:

521-524

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.294-296.521

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Online since:

November 1998

Authors:

Vera G. Sursaeva, Svetlana Protasova, A.Yu. Tuflin

Keywords:

Aluminum (Al), Compensation Effect, Compensation Temperature T_c, Grain Boundary, Grain Boundary Migration, Triple Junction Migration, Triple Junctions, Zinc

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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