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HomeMaterials Science ForumMaterials Science Forum Vols. 408-412Twin Nucleation at Triple Junction during Hot...

Twin Nucleation at Triple Junction during Hot Deformation of Copper Polycrystal

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Textures of Materials - ICOTOM 13

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Periodical:

Materials Science Forum (Volumes 408-412)

Pages:

755-760

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.408-412.755

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Online since:

August 2002

Authors:

Hiromi Miura, Haruka Hamaji, Taku Sakai

Keywords:

Copper (Cu), Dynamic Recrystallization (DRX), Grain Boundary Sliding (GBS), Nucleation, SEM/EBSP, Triple Junctions, Twin

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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