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HomeMaterials Science ForumMaterials Science Forum Vols. 408-412Dynamic Recrystallization at Triple Junction...

Dynamic Recrystallization at Triple Junction during High-Temperature Deformation in Copper Tricrystal

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Textures of Materials - ICOTOM 13

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Periodical:

Materials Science Forum (Volumes 408-412)

Pages:

761-766

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.408-412.761

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Online since:

August 2002

Authors:

Sutandyo Andiarwanto, Hiromi Miura, Taku Sakai

Keywords:

Copper (Cu), Dynamic Recrystallization (DRX), High-Temperature, Tensile Deformation, Tricrystal, Triple Junctions

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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