Dynamic Recrystallization at Triple Junction during High-Temperature Deformation in Copper Tricrystal

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Periodical:

Materials Science Forum (Volumes 408-412)

Edited by:

Dong Nyung Lee

Pages:

761-766

DOI:

10.4028/www.scientific.net/MSF.408-412.761

Citation:

S. Andiarwanto et al., "Dynamic Recrystallization at Triple Junction during High-Temperature Deformation in Copper Tricrystal", Materials Science Forum, Vols. 408-412, pp. 761-766, 2002

Online since:

August 2002

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$35.00

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