Cohesive Model for Thin Graded Film/Substrate Interfacial Cleavage Fracture

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Periodical:

Materials Science Forum (Volumes 423-425)

Edited by:

Wei Pan, Jianghong Gong, Lianmeng Zhang and Lidong Chen

Pages:

651-658

DOI:

10.4028/www.scientific.net/MSF.423-425.651

Citation:

R. Li and S. W. Yu, "Cohesive Model for Thin Graded Film/Substrate Interfacial Cleavage Fracture", Materials Science Forum, Vols. 423-425, pp. 651-658, 2003

Online since:

May 2003

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$35.00

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