Finite Element Analysis of Thermal Residual Stress in Ceramic Functional Graded Material: Interface Optimization for Residual Reduction

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Periodical:

Materials Science Forum (Volumes 423-425)

Edited by:

Wei Pan, Jianghong Gong, Lianmeng Zhang and Lidong Chen

Pages:

677-680

DOI:

10.4028/www.scientific.net/MSF.423-425.677

Citation:

L. K. Hou et al., "Finite Element Analysis of Thermal Residual Stress in Ceramic Functional Graded Material: Interface Optimization for Residual Reduction", Materials Science Forum, Vols. 423-425, pp. 677-680, 2003

Online since:

May 2003

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$35.00

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