Transient and Residual Stresses in a Hollow Cylinder of Functionally Graded Materials

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Periodical:

Materials Science Forum (Volumes 423-425)

Edited by:

Wei Pan, Jianghong Gong, Lianmeng Zhang and Lidong Chen

Pages:

665-670

DOI:

10.4028/www.scientific.net/MSF.423-425.665

Citation:

C. H. Chen and H. Awaji, "Transient and Residual Stresses in a Hollow Cylinder of Functionally Graded Materials", Materials Science Forum, Vols. 423-425, pp. 665-670, 2003

Online since:

May 2003

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$35.00

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