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HomeMaterials Science ForumMaterials Science Forum Vols. 423-425Computational Micromechanics Analysis of the...

Computational Micromechanics Analysis of the Functionally Graded Materials under Thermal Shock Loading

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Functionally Graded Materials VII

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Periodical:

Materials Science Forum (Volumes 423-425)

Pages:

687-692

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.423-425.687

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Online since:

May 2003

Authors:

Shu Yong Yang, Qing Jie Zhang, Peng Cheng Zhai

Keywords:

Computational Micromechanics Method, Finite Element, Thermal Shock, Thermal Stress

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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