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Glide and Climb of Dislocations in Ultra-Thin Metal Films
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Characterization of Anodic Films Formed on Mg-Al Alloys in Alkaline Bath
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Tailoring of the Elastic Properties by Texture Control in Ferroelectric Thin Films for MEMS
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Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization
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Thermoelectric Properties of CoSi Thin films
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Structural and Mechanical Properties of Stainless Steel Thin Films Elaborated by Thermal Evaporation and Ion Beam Sputtering
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Formation of Calcium Phosphate Film on Ti Substrate in Aqueous Solutions in the Control of Temperature and Ion Activity
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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Chemical Vapor Deposition of Cr-Based Thin Films...

Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

3439-3444

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.3439

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Online since:

August 2003

Authors:

Francis Maury, C. Gasquères, F.-D. Duminica, F. Ossola

Keywords:

Cr₃(C,N)₂ Films, Cr-Based Layers, CrSi_xC_y Films, Diffusion Barrier, MOCVD

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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