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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432The Pinning of Grain Boundaries during the...

The Pinning of Grain Boundaries during the Recrystallization of an Al-0.3Mn-0.15Si Alloy

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

501-506

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.501

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Online since:

August 2003

Authors:

Yan Huang, John F. Humphreys

Keywords:

Aluminium Alloy, Electron Backscatter Diffraction (EBSD), Grain Boundary Migration, In Situ Annealing, Second Phase Particle, Zener Pinning

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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