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HomeMaterials Science ForumMaterials Science Forum Vol. 439Effects of Fourth Alloying Additives on...

Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints

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Periodical:

Materials Science Forum (Volume 439)

Pages:

7-11

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.439.7

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Online since:

November 2003

Authors:

K.S. Kim, Katsuaki Suganuma, Toshitada Shimozaki, C.G. Lee

Keywords:

Additive, Lead-Free Solder, Microstructure, Sn-Ag-Cu Alloy

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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