Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints

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Periodical:

Edited by:

Hyung Sun Kim, Sang-Yeup Park and Soo Wohn Lee

Pages:

7-11

DOI:

10.4028/www.scientific.net/MSF.439.7

Citation:

K.S. Kim et al., "Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints", Materials Science Forum, Vol. 439, pp. 7-11, 2003

Online since:

November 2003

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$35.00

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