Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints

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Edited by:

Hyung Sun Kim, Sang-Yeup Park and Soo Wohn Lee

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7-11

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K.S. Kim et al., "Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints", Materials Science Forum, Vol. 439, pp. 7-11, 2003

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November 2003

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