Fabrication of Copper Clad Aluminum Wire (CCAW) by Indirect Extrusion and Drawing

Hyouk Chon Kwon; Taek Kyun Jung; Sung Chul Lim; Mok Soon Kim

doi:10.4028/www.scientific.net/MSF.449-452.317

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HomeMaterials Science ForumMaterials Science Forum Vols. 449-452Fabrication of Copper Clad Aluminum Wire (CCAW) by...

Fabrication of Copper Clad Aluminum Wire (CCAW) by Indirect Extrusion and Drawing

Abstract:

The optimized extrusion conditions from the present research were the extrusion temperature of 573~623K and the extrusion ratio(A0/A) of 21.39. Above the extrusion temperature of 623K, the fracture of sheath material was observed. It is due to the difference of flow stress between the sheath material and the core material during extrusion process. The bonding strength increased with increasing the extrusion temperature and the extrusion ratio. The bonding strength increased with increasing the annealing temperature. However, over 573K, it decreased abruptly since the thick and brittle intermetallic compounds of larger than 3µm were formed. The electricalconductivity of copper clad aluminum wire was about 70%IACS without annealing.

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Periodical:

Materials Science Forum (Volumes 449-452)

Pages:

317-320

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.449-452.317

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Online since:

March 2004

Authors:

Hyouk Chon Kwon, Taek Kyun Jung, Sung Chul Lim, Mok Soon Kim

Keywords:

Copper-Clad Aluminum Wire (CCAW), Indirect Extrusion

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