Fabrication of Copper Clad Aluminum Wire (CCAW) by Indirect Extrusion and Drawing

Abstract:

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The optimized extrusion conditions from the present research were the extrusion temperature of 573~623K and the extrusion ratio(A0/A) of 21.39. Above the extrusion temperature of 623K, the fracture of sheath material was observed. It is due to the difference of flow stress between the sheath material and the core material during extrusion process. The bonding strength increased with increasing the extrusion temperature and the extrusion ratio. The bonding strength increased with increasing the annealing temperature. However, over 573K, it decreased abruptly since the thick and brittle intermetallic compounds of larger than 3µm were formed. The electricalconductivity of copper clad aluminum wire was about 70%IACS without annealing.

Info:

Periodical:

Materials Science Forum (Volumes 449-452)

Edited by:

S.-G. Kang and T. Kobayashi

Pages:

317-320

Citation:

H. C. Kwon et al., "Fabrication of Copper Clad Aluminum Wire (CCAW) by Indirect Extrusion and Drawing", Materials Science Forum, Vols. 449-452, pp. 317-320, 2004

Online since:

March 2004

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$38.00

[1] Y. Yamaguchi: J. of the Japan Society for Technology of Plasticity, vol. 15, (1974) p.723.

[2] H. J. Park, K. H. Na: J. of the Korean Society for Technology of Plasticity, Vol. 4, (1994) p.123.

[3] J. H. Kim, B. K. Suh: J. Kor. Inst. Met. & Mater, Vol. 38, (2000).

[4] C. G. Kang, H. C. Kwon: International Journal of Mechanical Sciences Vol. 44 (2002) p.247.

[2] [4] [6] [8] [10] 250 300 350 400 450 500 550 600 650.

[40] [50] [60] [70] [80] [90] Diffusion layer thickness(um) Bonding strength(MPa) Bonding strength(MPa) Annealing temperature(K) Diffusion layer thickness(um) 1mm.

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