Study on Hole Making in EACVD Thick Diamond Film

Dun Wen Zuo; Wen Zhuang Lu; Xiang Feng Li; X.Q. Chu; Min Wang

doi:10.4028/www.scientific.net/MSF.471-472.644

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HomeMaterials Science ForumMaterials Science Forum Vols. 471-472Study on Hole Making in EACVD Thick Diamond Film

Study on Hole Making in EACVD Thick Diamond Film

Abstract:

Few research works have been reported on hole making in EACVD thick diamond film, though many papers have been published on the preparation and smoothing of the film. In this paper, YAG laser and EDM were used to make holes in un-doped and Boron-doped diamond film respectively. Fundamental investigation was carried out on the effects of processing parameters on the holing efficiency and processed surface quality. The film surface was analyzed by means of Raman spectrum before and after holing. It is shown that YAG laser has a higher processing efficiency than EDM, but the latter can get a rounder hole.

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Materials Science Forum (Volumes 471-472)

Pages:

644-648

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.471-472.644

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Online since:

December 2004

Authors:

Dun Wen Zuo, Wen Zhuang Lu, Xiang Feng Li, X.Q. Chu, Min Wang

Keywords:

EACVD, Electro Discharge Machining (EDM), Holing, Thick Diamond Film, YAG Laser

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References

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