In this study, the electromagnetic vibration process is adopted for modifying the eutectic Si phase and reducing its size. The higher the current density and frequency of electromagnetic vibration (EMV), the finer the size of the eutectic Si phase. The tensile strength and elongation of EMVed alloys were highly improved. Measured twin probability of EMVed alloy at a frequency of 1000Hz was approximately six times as high as that of the normal alloy and half of that of Sr modified alloy. The mechanism for the increase in twin density due to EMV during solidification could be suggested from the fact that the preferential growth along <112> in silicon was suppressed by preventing the Si atom from attaching to the growing interface of the Si phase and by changing the solid/liquid interfacial energy of silicon.