Investigation on Microstructure Transformation and Failure Behavior of Cu-Cd-Nb-CP Electrical Contact Material

Yu Sheng Cui; Wen Zhu Shao; L. Zhen; V.V. Ivanov

doi:10.4028/www.scientific.net/MSF.475-479.869

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HomeMaterials Science ForumMaterials Science Forum Vols. 475-479Investigation on Microstructure Transformation and...

Investigation on Microstructure Transformation and Failure Behavior of Cu-Cd-Nb-C_P Electrical Contact Material

Abstract:

Dependence of microstructure upon transfer stability of the powder-metallurgy copperdiamond electrical contact material with Cr and Nb addition during type-test process is investigated by optical microscope and SEM observation. During making and breaking process, micro-cracks occurred along grain boundaries under electrical and mechanical forces. Addition of cadmium into the composite increases oxidizable capability of this material, and also leads to oxide accumulation along grain boundaries. These factors reduce the reliability of electrical contacts in practice. Arc erosion quantities during commutation operation processes relates with grain size of matrix and particle size of the second metallic phase. The optimal grain size is 20~50µm and 10~20 µm for niobium particles in these tests.

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Periodical:

Materials Science Forum (Volumes 475-479)

Pages:

869-872

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.475-479.869

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Online since:

January 2005

Authors:

Yu Sheng Cui, Wen Zhu Shao, L. Zhen, V.V. Ivanov

Keywords:

Copper-Based Composite, Electrical Contact Material, Microstructure, Performance

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