Investigation on Microstructure Transformation and Failure Behavior of Cu-Cd-Nb-CP Electrical Contact Material

Abstract:

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Dependence of microstructure upon transfer stability of the powder-metallurgy copperdiamond electrical contact material with Cr and Nb addition during type-test process is investigated by optical microscope and SEM observation. During making and breaking process, micro-cracks occurred along grain boundaries under electrical and mechanical forces. Addition of cadmium into the composite increases oxidizable capability of this material, and also leads to oxide accumulation along grain boundaries. These factors reduce the reliability of electrical contacts in practice. Arc erosion quantities during commutation operation processes relates with grain size of matrix and particle size of the second metallic phase. The optimal grain size is 20~50µm and 10~20 µm for niobium particles in these tests.

Info:

Periodical:

Materials Science Forum (Volumes 475-479)

Main Theme:

Edited by:

Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie

Pages:

869-872

DOI:

10.4028/www.scientific.net/MSF.475-479.869

Citation:

Y. S. Cui et al., "Investigation on Microstructure Transformation and Failure Behavior of Cu-Cd-Nb-CP Electrical Contact Material", Materials Science Forum, Vols. 475-479, pp. 869-872, 2005

Online since:

January 2005

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$35.00

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