X-Ray Study of Microstresses in Lamellar Pearlite

Nikolay Y. Zolotorevsky; D.M. Vasiliev; Yuri Titovets

doi:10.4028/www.scientific.net/MSF.495-497.1511

Paper Titles

Anisotropic Increase in Yield Strength by Straining and Baking of Bake-Hardenable Steel
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Texture Development during Mechanical r-Value Determination
p.1493

Toughness Anisotropy in Intercritically Rolled Steel Plates
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Allowance for Internal Microstresses and Texture in Evaluation of Residual Stresses in Cold-Drawn Steel Wires with Micromechanical Models
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X-Ray Study of Microstresses in Lamellar Pearlite
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The Effect of Anisotropic Yielding Behaviour on Cold Rolling Forces
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Interactive Texture- and Finite-Element Simulation Including the Bauschinger Effect
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Simulation of Earing during Deep Drawing of bcc Steel by Use of a Texture Component Crystal Plasticity Finite Element Method
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Texture-Based Explicit Finite-Element Analysis of Sheet Metal Forming
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HomeMaterials Science ForumMaterials Science Forum Vols. 495-497X-Ray Study of Microstresses in Lamellar Pearlite

X-Ray Study of Microstresses in Lamellar Pearlite

Abstract:

The material studied was commercial pearlitic steel deformed by cold drawing. Internal stresses appearing due to the plastic interaction of cementite and ferrite phases of the lamellar pearlite (interphase stresses) were examined in order to clarify the mechanisms controlling plastic behavior of the lamellar pearlite. It was shown that, while the interphase stress level is high at relatively small drawing strain, it is significantly reduced with true strain increasing up to e = 2. The high level of the interphase stress is restored after annealing of the heavily drawn wire and its repeated straining. This result is considered to support a suggestion that the reduction of interphase stress under severe cold drawing is caused by a transformation of the cementite lamellae substructure.

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Materials Science Forum (Volumes 495-497)

Pages:

1511-1516

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.495-497.1511

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Online since:

September 2005

Authors:

Nikolay Y. Zolotorevsky, D.M. Vasiliev, Yuri Titovets

Keywords:

Crystallographic Texture, Residual Stress, Wire Drawing, X-Ray Diffraction (XRD)

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