Joining of Tungsten-Copper Using Pulse Electric Current Sintering Method

Yasushi Fukuzawa; Shigeru Nagasawa; Masahiro Watanabe; Shigehiko Takaoka

doi:10.4028/www.scientific.net/MSF.502.443

Paper Titles

The Effects of Thickness and Underlayer on Both Grain Growth and Internal Stresses in Cu Thin Films
p.417

Production of Diamond Tools by Brazing
p.425

Novel Method for Diffusion Bonding Superalloys and Aluminium Alloys (USA Patent 6,669,534 B2, European Patent Pending)
p.431

Microstructure and Mechanical Properties of Hyper-Interfacial Bonded Joints of Ultra-Fine Grained High Strength Steels
p.437

Joining of Tungsten-Copper Using Pulse Electric Current Sintering Method
p.443

Interface Behavior in Liquid Phase Impact Diffusion Welding of Aluminum Matrix Composite
p.449

Estimation of Mechanical Properties of Al/Cu Compound Layer Formed by Impact Welding
p.455

Microstructure of SiC / TiAl Interface Formed by Solid-State Diffusion Bonding
p.461

Comparative Study on Microstructure and Strength of TiAl/Steel Joints Brazed with Ag-Cu-Ti and Ag-Cu-Zn Filler Metals
p.467

HomeMaterials Science ForumMaterials Science Forum Vol. 502Joining of Tungsten-Copper Using Pulse Electric...

Joining of Tungsten-Copper Using Pulse Electric Current Sintering Method

Abstract:

To develop the new bonding method under low bonding temperature and short holding duration, pulse electric current sintering (PECS) method is applied. The Ni plating layer was used as the interlayer. The following experimental factors were researched:(1) Thickness of Ni plating layer, (2) Bonding temperature, (3) Bonding pressure and (4) Heat treatment after plating. The bonding strength of W-Ni plate-Cu joint could be obtained under low bonding temperature of 773 K and short bonding duration of 10 min.