Joining of Tungsten-Copper Using Pulse Electric Current Sintering Method

Abstract:

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To develop the new bonding method under low bonding temperature and short holding duration, pulse electric current sintering (PECS) method is applied. The Ni plating layer was used as the interlayer. The following experimental factors were researched:(1) Thickness of Ni plating layer, (2) Bonding temperature, (3) Bonding pressure and (4) Heat treatment after plating. The bonding strength of W-Ni plate-Cu joint could be obtained under low bonding temperature of 773 K and short bonding duration of 10 min.

Info:

Periodical:

Edited by:

Masaaki Naka and Toshimi Yamane

Pages:

443-448

DOI:

10.4028/www.scientific.net/MSF.502.443

Citation:

Y. Fukuzawa et al., "Joining of Tungsten-Copper Using Pulse Electric Current Sintering Method ", Materials Science Forum, Vol. 502, pp. 443-448, 2005

Online since:

December 2005

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Price:

$35.00

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