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HomeMaterials Science ForumMaterials Science Forum Vol. 502The Effects of Thickness and Underlayer on Both...

The Effects of Thickness and Underlayer on Both Grain Growth and Internal Stresses in Cu Thin Films

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Periodical:

Materials Science Forum (Volume 502)

Pages:

417-424

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.502.417

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Online since:

December 2005

Authors:

Shinji Takayama, Makoto Oikawa

Keywords:

Cu Films, Grain Growth, Hardness, Internal Stress, Void

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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