The Effects of Thickness and Underlayer on Both Grain Growth and Internal Stresses in Cu Thin Films

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Periodical:

Edited by:

Masaaki Naka and Toshimi Yamane

Pages:

417-424

DOI:

10.4028/www.scientific.net/MSF.502.417

Citation:

S. Takayama and M. Oikawa, "The Effects of Thickness and Underlayer on Both Grain Growth and Internal Stresses in Cu Thin Films ", Materials Science Forum, Vol. 502, pp. 417-424, 2005

Online since:

December 2005

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$35.00

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