Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint

Abstract:

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Berkovich micro-indentation tests with different loading rates have been performed on the ball grid array solder joint with a Pb-free solder, Sn-4.0Ag-0.5Cu alloy. The resulting indentation load-depth curves are rate dependent and have varying creep penetration depths during the same hold time. Creep indentation hardness and rate sensitivity have been defined from the concept of “work of indentation”. The rate sensitivity of BGA solder joint is 0.0574.

Info:

Periodical:

Edited by:

Masaaki Naka and Toshimi Yamane

Pages:

399-404

DOI:

10.4028/www.scientific.net/MSF.502.399

Citation:

F. J. Wang et al., "Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint ", Materials Science Forum, Vol. 502, pp. 399-404, 2005

Online since:

December 2005

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Price:

$35.00

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