Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint

Feng Jiang Wang; Xin Ma; Yiyu Qian

doi:10.4028/www.scientific.net/MSF.502.399

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HomeMaterials Science ForumMaterials Science Forum Vol. 502Indentation Rate-Dependent Creep Behavior of...

Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint

Abstract:

Berkovich micro-indentation tests with different loading rates have been performed on the ball grid array solder joint with a Pb-free solder, Sn-4.0Ag-0.5Cu alloy. The resulting indentation load-depth curves are rate dependent and have varying creep penetration depths during the same hold time. Creep indentation hardness and rate sensitivity have been defined from the concept of “work of indentation”. The rate sensitivity of BGA solder joint is 0.0574.

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Periodical:

Materials Science Forum (Volume 502)

Pages:

399-404

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.502.399

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Online since:

December 2005

Authors:

Feng Jiang Wang, Xin Ma, Yiyu Qian

Keywords:

BGA, Creep, Micro Indentation, Sn-4.0Ag-0.5Cu

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