Effect of Initial Grain Size, Die Angle and Pass Sequence on the Formation of Ultrafine Grain Structure in Cu by ECAP

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Periodical:

Materials Science Forum (Volumes 503-504)

Edited by:

Zenji Horita

Pages:

25-30

DOI:

10.4028/www.scientific.net/MSF.503-504.25

Citation:

A. Mishra et al., "Effect of Initial Grain Size, Die Angle and Pass Sequence on the Formation of Ultrafine Grain Structure in Cu by ECAP", Materials Science Forum, Vols. 503-504, pp. 25-30, 2006

Online since:

January 2006

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$35.00

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