A Simple Reliable Method of Selecting Epoxy Molding Compounds for High Power Short Wavelength Light Emitting Diode Packages

Chong Mu Lee; Seung Mo Kang; Keun Bin Yim; Sook Joo Kim; Hyoun Woo Kim

doi:10.4028/www.scientific.net/MSF.510-511.154

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Appearance of Indium Oxide Nanorods in MOCVD Growth
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A Simple Reliable Method of Selecting Epoxy Molding Compounds for High Power Short Wavelength Light Emitting Diode Packages
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A Slow Strain Rate Test Experiment to Evaluate the Characteristics of High-Strength Al-Mg Alloy for Application in Ships
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HomeMaterials Science ForumMaterials Science Forum Vols. 510-511A Simple Reliable Method of Selecting Epoxy...

A Simple Reliable Method of Selecting Epoxy Molding Compounds for High Power Short Wavelength Light Emitting Diode Packages

Abstract:

Epoxy molding compounds (EMC) with higher thermal stabilities are urgently needed as the light emitting diode (LED) becomes brighter and the wavelength of the its light becomes shorter. This paper proposes a simple reliable method of evaluating the thermal stabilities of commercial EMCs. The transmittances of most commercial EMC samples for high power short wavelength LED packages were decreased by heat treatment at 150oC for 200hr. Also the thermal stabilities of the samples were confirmed by measuring the weight losses through TGA. The experimental results suggest that employing a good heatsink is indispensable in highly bright short wavelength LED packages.

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Periodical:

Materials Science Forum (Volumes 510-511)

Pages:

154-157

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.510-511.154

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Online since:

March 2006

Authors:

Chong Mu Lee, Seung Mo Kang, Keun Bin Yim, Sook Joo Kim, Hyoun Woo Kim

Keywords:

Epoxy, Light Emitting Diode (LED), Molding Compound, Package, Thermal Stability

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